Corsair DDR2 And DDR3 Product




DOMINATOR™ - Extreme Performance, Overclockable Memory
The DOMINATOR family of memory represents the ultimate in performance technology engineering from Corsair. The DOMINATOR was designed to have the highest performing IC maximum over-clocking capability and efficient DHX cooling – all the while being stable and reliable.
DDR3 Modules
ddTable.push('TW3X2G2133C9DF');
ddTable.push('TW3X2G2000C9DFNV');
ddTable.push('TW3X4G2000C9DF');
ddTable.push('TWIN3X2048-1800C7DF');
ddTable.push('TWIN3X2048-1800C7DFIN');
ddTable.push('TW3X4G1800C8DF');
Part Number
Speed
Size
Latency
Package
TW3X2G2133C9DF
PC3-17066
2GB Kit
9-9-9-24
240pin DIMM
TW3X2G2000C9DFNV
PC3-16000
2GB Kit
9-9-9-24
240pin DIMM
TW3X4G2000C9DF
PC3-16000
4GB Kit
9-9-9-24
240pin DIMM
TWIN3X2048-1800C7DF
PC3-14400
2GB Kit
7-7-7-20
240pin DIMM
TWIN3X2048-1800C7DFIN *
PC3-14400
2GB Kit
7-7-7-20
240pin DIMM
TW3X4G1800C8DF
PC3-14400
4GB Kit
8-8-8-24
240pin DIMM * Supports Intel Extreme Memory Profiles
DDR2 Modules
ddTable.push('TWIN2X4096-9136C5DF');
ddTable.push('TWIN2X2048-8500C5D');
ddTable.push('TWIN2X2048-8500C5DF');
ddTable.push('QUAD2X4096-8500C5DF');
ddTable.push('TWIN2X4096-8500C5D');
ddTable.push('TWIN2X4096-8500C5DF');
Part Number
Speed
Size
Latency
Package
TWIN2X4096-9136C5DF
PC2-9136
4GB Kit
5-5-5-15
240pin DIMM
TWIN2X2048-8500C5D
PC2-8500
2GB Kit
5-5-5-15
240pin DIMM
TWIN2X2048-8500C5DF
PC2-8500
2GB Kit
5-5-5-15
240pin DIMM
QUAD2X4096-8500C5DF
PC2-8500
4GB Kit
5-5-5-15
240pin DIMM
TWIN2X4096-8500C5D
PC2-8500
4GB Kit
5-5-5-15
240pin DIMM
TWIN2X4096-8500C5DF
PC2-8500
4GB Kit
5-5-5-15
240pin DIMM
DOMINATOR - Best of Corsair’s Engineering
Very few components make it into the DOMINATOR family. Corsair performs rigorous testing and screening on all components to select only the best for the DOMINATOR modules. The tests check for high frequency and/or low latency capabilities for each IC. Then, they are thoroughly tested for maximum interoperability and reliability as a united group to meet the stringent design criteria demanded by performance computing and gaming users.
Superior Heat Dissipation
Heat is the enemy of your computer’s key components. And the more you tweak components for performance, the more heat is generated. Heat will slow down your system and impact long term reliability. With traditional DDR2 memory, the standard method of chip packaging involves a BGA (Ball Grid Array). In a BGA, small balls of solder, organized as a grid, are the leads that connect the device to the module circuit board. A Micron Semiconductor study shows that in a BGA memory device as much as 50% of the heat generated by the chip is actually conducted into the circuit board. Since traditional heat sinks are only attached to the front surface of memory chips, there’s no easy thermal path for the heat coming from the back of the chips.

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